The 3rd installment of the China-U.S. Telecom Summit will take pl...

The 3rd installment of the China-U.S. Telecom Summit will take place before Supercomm in Chicago, TIA announced Fri. The summit, June 17-19 at McCormick Place, is sponsored by NTIA and the Commerce Dept.’s International Trade Administration (ITA) in partnership with TIA. “The summit provides U.S. officials and company executives a unique opportunity to engage in dialogue on communications development in China, the world’s largest and fastest growing market,” TIA said. The event will be lead by Commerce Secy. Donald Evans and China’s Ministry of Information Industry Minister Wang Xudong. Summit participants will also be invited to attend Supercomm. Industry representatives are invited to a public organizational briefing on Thurs. at 10:30 a.m. at the City Club of Washington, Franklin Square, 1300 I St. Acting NTIA Dir. Michael Gallagher and TIA Pres. Matthew Flanigan are to speak. RSVP Ashley Heineman at 703- 907-7734, aheineman@tiaonline.org.